Application-Specific Integrated Circuit design covers the full front-end and back-end flow required to turn a functional specification into silicon-ready design data. This includes RTL architecture and coding, functional verification using industry-standard methodologies such as UVM, logic synthesis, timing closure, and static timing analysis (STA). Each stage is built to reduce respin risk and ensure the design meets power, performance, and area targets before it moves to physical implementation.

Our ASIC design practice supports customers across the product lifecycle, from early architecture exploration through to tape-out readiness, working closely with foundry and packaging partners to ensure manufacturability. With Accord Prime working toward semiconductor manufacturing in India, our teams bring practical process awareness to design trade-offs that purely design-side teams often lack, particularly for legacy and mixed-signal process nodes. This work also spans analog and mixed-signal design, RTL coding, design verification, physical design, and foundry porting for customers migrating designs across process nodes.

Design for Test is a specialized discipline focused on building testability directly into a chip's architecture, rather than treating test as an afterthought once the design is complete. Our DFT engineers implement scan chain insertion, Automatic Test Pattern Generation (ATPG), Memory Built-In Self-Test (MBIST), and JTAG boundary-scan structures, all aimed at maximizing fault coverage while minimizing silicon area and test time overhead.

Well-executed DFT directly affects a product's manufacturing yield and cost of test at the tester, making it one of the most consequential activities in the semiconductor development flow. Our team also supports post-silicon test diagnosis, helping customers correlate ATE test failures back to specific design structures so that yield-limiting issues can be identified and resolved quickly.

Field-Programmable Gate Array design and prototyping allow customers to validate complex digital logic in hardware long before committing to an ASIC tape-out. Our team develops FPGA-based implementations for functional verification, system-level integration testing, and hardware emulation, giving program teams a working platform to de-risk architecture decisions early in the design cycle.

We also support ASIC-to-FPGA migration and the reverse path, translating designs between the two implementation targets while preserving functional equivalence and adapting for the constraints of each platform. This capability is particularly valuable for defense and industrial programs, where FPGAs are frequently used both as a prototyping vehicle and as a long-term production solution in lower-volume applications.

Silicon validation is the critical checkpoint between fabrication and product release. Our engineers lead first-silicon bring-up activities, systematically powering up new devices, verifying core functionality, and characterizing performance against design targets. This process identifies deviations early, whether from process variation, design margin issues, or packaging effects, so they can be addressed before large-scale production begins.

When unexpected behavior is observed, our validation team works alongside failure analysis specialists to isolate root cause, using electrical characterization, targeted probing, and correlation with design and process data. This closed-loop approach between validation and failure analysis shortens the time to resolution and gives customers confidence in the reliability of their device before it reaches the field.

Board-level engineering bridges the gap between a finished die and a working product. Our team designs evaluation and characterization boards used to validate new silicon against its datasheet specifications, covering electrical, thermal, and functional parameters across voltage, temperature, and process corners. This work is essential for confirming that a device performs as intended before it is qualified for volume production.

Beyond board design, we provide structured test engineering support: developing test plans, building measurement and data-capture setups, and executing validation testing that feeds directly into a device's qualification record. For customers bringing new silicon to market, this evaluation and test infrastructure often determines how quickly a part can move from first samples to customer sampling and production release.

IC package design is the engineering discipline that connects a finished die to the outside world, defining how signals, power, and ground are routed from silicon to board while managing thermal and mechanical constraints. Our team designs Flip-Chip Ball Grid Array (FCBGA) and wirebond packages, along with System-in-Package (SiP) integrations that combine multiple die or components within a single package footprint.

Package design decisions have a direct impact on electrical performance, thermal dissipation, and overall manufacturing yield, making close collaboration with semiconductor firms and Outsourced Semiconductor Assembly and Test (OSAT) partners essential. Our engineers conduct thermal analysis and package routing studies early in the design cycle to ensure the chosen package architecture can meet both performance requirements and production cost targets.

Production test engineering ensures that every device leaving the factory meets its specified performance and reliability requirements, at the speed and cost structure required for volume manufacturing. Our team develops Automated Test Equipment (ATE) test programs, correlating device behavior against datasheet limits and building test flows that balance thorough coverage with tester time, a direct driver of unit test cost.

We also support ongoing yield improvement initiatives, analyzing production test data to identify systematic failure patterns and working with design and process teams to address root causes. Our scope includes bench-to-ATE correlation, cross-tester platform conversion, vector conversion, and test IP development, so that quality is maintained as production volumes scale and cost of test per unit is reduced.

Printed circuit board design translates a system-level electrical architecture into a manufacturable board, encompassing schematic capture, component selection, layout, and stack-up definition. Our engineers apply Design for Manufacturing (DFM) and Design for Test (DFT) principles throughout the layout process, reducing the likelihood of fabrication defects and simplifying test access once boards reach production.

We support board designs across industrial, telecommunications, medical, and aerospace applications, each with its own regulatory and reliability requirements. Human-Computer Interface (HCI) board design, covering displays, controls, and sensor interfaces, is a particular area of focus, requiring careful attention to signal integrity, power delivery, and mechanical integration alongside the core electrical design. We also support burn-in board and ATE PCB design for customers who need test-side hardware alongside product boards.

High-speed board design addresses the electrical challenges that arise as data rates increase across memory, storage, and networking interfaces. Our team designs and validates boards implementing DDR memory interfaces, PCI Express, USB, Ethernet, and SerDes links, where signal timing, impedance control, and layout precision directly determine whether an interface will meet its specified data rate reliably.

This capability has become increasingly central to AI hardware, networking equipment, and data center infrastructure, where high-speed interconnects are foundational to system performance. Our engineers work closely with signal integrity specialists throughout layout and validation to ensure high-speed links meet compliance standards before a board moves into system integration.

Signal Integrity (SI) and Power Integrity (PI) engineering ensures that a board's electrical performance matches its design intent under real operating conditions. Our engineers perform SI simulation to verify signal quality across high-speed interconnects and PI analysis to confirm stable, low-noise power delivery to sensitive components, both essential as clock speeds and component density continue to increase.

We also address electromagnetic interference and compatibility (EMI/EMC) and thermal analysis, helping customers meet regulatory emissions and susceptibility requirements for telecommunications, aerospace, high-performance computing, and automotive applications. Identifying and resolving SI/PI, thermal, and EMI issues during the design phase, rather than after prototype testing, significantly reduces the cost and schedule impact of late-stage board respins.

Embedded software and firmware development brings hardware to life at the code level. Our engineers develop Linux Board Support Packages (BSPs), real-time operating system (RTOS) integrations, low-level device drivers, and application firmware tailored to a customer's specific silicon and board design. This work requires close coordination with hardware teams to ensure firmware correctly accounts for board-level electrical and timing constraints.

We support embedded development for industrial automation, medical devices, and automotive OEM programs, as well as IoT products requiring connectivity and remote management, and increasingly, embedded AI workloads running on edge hardware. Our scope extends from embedded application software and firmware through to turnkey embedded product development and system-on-module (SOM) integration, recognizing that embedded firmware often has a much longer service life than software on general-purpose computing platforms.

Our talent development programs address a persistent industry challenge: the gap between academic curricula and the practical skills required for semiconductor and electronics engineering roles. We deliver structured training in ASIC design, DFT, embedded systems, PCB design, and test engineering, combining conceptual instruction with hands-on lab work using industry-standard tools and methodologies.

These programs are designed for both university and college students preparing to enter the workforce, and for corporate engineering teams looking to build or refresh specific technical skill sets. By grounding instruction in real design and test practices used across our own engineering programs, we aim to shorten the ramp-up time for engineers moving into semiconductor and electronics careers.